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Palyginkite Vaizdas Dalis # Gamintojas apibūdinimas Inventorius Duomenų lapai RoHS Susisiekite su Finish Thickness - Post Darbinė temperatūra Montavimo tipas Nutraukimas Įveskite funkcijos Medžiagų degumo įvertinimas Būsto medžiaga Pikis - poravimas Susisiekite su Finish - poravimosi Susisiekite su Finish Thickness - poravimosi Susisiekite su Finish - paštu Serija Pozicijų arba kaiščių skaičius (tinklelis) Kontaktinė medžiaga - poravimas Pitch - pranešimas Kontaktai medžiaga - pranešimas Nutraukimo įrašo trukmė Susisiekite su rezistencija Dabartinis įvertinimas (AMPS) Bazinis produkto numeris Paketas Kiekis
8444-21B1-RK-TR 8444-21B1-RK-TR 3M CONN SOCKET PLCC 44POS TIN Sandelyje11559 pcs 8444-21B1-RK-TR.pdf 160.0µin (4.06µm) -40°C ~ 105°C Surface Mount Solder PLCC Closed Frame UL94 V-0 Polybutylene Terephthalate (PBT), Glass Filled 0.050' (1.27mm) Tin 160.0µin (4.06µm) Tin 8400 44 (4 x 11) Copper Alloy 0.050' (1.27mm) Copper Alloy 0.132' (3.35mm) 15mOhm 1 A 8444 Tape & Reel (TR)
116-83-428-41-006101 116-83-428-41-006101 Preci-Dip CONN IC DIP SOCKET 28POS GOLD Sandelyje48145 pcs   - -55°C ~ 125°C Through Hole Solder DIP, 0.4' (10.16mm) Row Spacing Elevated, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100' (2.54mm) Gold 29.5µin (0.75µm) Tin 116 28 (2 x 14) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) 10mOhm 1 A 116-83 Bulk
110-87-318-41-005101 110-87-318-41-005101 Preci-Dip CONN IC DIP SOCKET 18POS GOLD Sandelyje36125 pcs   - -55°C ~ 125°C Through Hole Solder DIP, 0.3' (7.62mm) Row Spacing Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100' (2.54mm) Gold Flash Tin 110 18 (2 x 9) Beryllium Copper 0.100' (2.54mm) Brass - 10mOhm 1 A 110-87 Bulk
8428-21B1-RK-TP 8428-21B1-RK-TP 3M CONN SOCKET PLCC 28POS TIN Sandelyje2023 pcs 8428-21B1-RK-TP.pdf 160.0µin (4.06µm) -40°C ~ 105°C Surface Mount Solder PLCC Closed Frame UL94 V-0 Polybutylene Terephthalate (PBT), Glass Filled 0.050' (1.27mm) Tin 160.0µin (4.06µm) Tin 8400 28 (4 x 7) Copper Alloy 0.050' (1.27mm) Copper Alloy 0.132' (3.35mm) - 1 A 8428 Tube
78499-0002 78499-0002 Molex 6.50 BY 6.50MM CAMERA SOCKET, 3. Sandelyje49332 pcs 78499-0002.pdf - - - - - - - - - - - - * - - - - - - - - Box
A 08-LC-TT A 08-LC-TT Assmann WSW Components CONN IC DIP SOCKET 8POS TIN Sandelyje108344 pcs A 08-LC-TT.pdf - -55°C ~ 85°C Through Hole Solder DIP, 0.3' (7.62mm) Row Spacing Open Frame UL94 V-0 Polybutylene Terephthalate (PBT) 0.100' (2.54mm) Tin - Tin - 8 (2 x 4) Phosphor Bronze 0.100' (2.54mm) Phosphor Bronze 0.124' (3.15mm) 30mOhm 1 A A 08-LC Tube
AR16-HZW/T AR16-HZW/T Assmann WSW Components CONN IC DIP SOCKET 16POS GOLD Išparduota AR16-HZW/T.pdf 200.0µin (5.08µm) -40°C ~ 105°C Through Hole Wire Wrap DIP, 0.3" (7.62mm) Row Spacing Open Frame UL94 V-0 Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin - 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - 4mOhm 3 A AR16-HZ Bag
210-99-632-41-001000 210-99-632-41-001000 Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS TINLEAD Sandelyje43016 pcs 210-99-632-41-001000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder DIP, 0.6' (15.24mm) Row Spacing Closed Frame - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100' (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 210 32 (2 x 16) Beryllium Copper 0.100' (2.54mm) Brass Alloy 0.125' (3.18mm) - 3 A 210-99 Tube
110-99-424-41-001000 110-99-424-41-001000 Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS TINLEAD Sandelyje32481 pcs   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder DIP, 0.4' (10.16mm) Row Spacing Open Frame - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100' (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 110 24 (2 x 12) Beryllium Copper 0.100' (2.54mm) Brass Alloy 0.125' (3.18mm) - 3 A 110-99 Tube
612-83-650-41-001101 612-83-650-41-001101 Preci-Dip CONN IC DIP SOCKET 50POS GOLD Sandelyje46317 pcs   - -55°C ~ 125°C Through Hole Solder DIP, 0.6" (15.24mm) Row Spacing Carrier, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 612 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass 0.291" (7.39mm) 10mOhm 1 A 612-83 Bulk
510-87-096-11-041101 Preci-Dip CONN SOCKET PGA 96POS GOLD Sandelyje41478 pcs   - -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100' (2.54mm) Gold Flash Tin 510 96 (11 x 11) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) 10mOhm 1 A 510-87 Bulk
40-6508-311 Aries Electronics CONN IC DIP SOCKET 40POS GOLD Sandelyje49293 pcs 40-6508-311.pdf 10.0µin (0.25µm) -55°C ~ 125°C Through Hole Wire Wrap DIP, 0.6' (15.24mm) Row Spacing Open Frame UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100' (2.54mm) Gold 30.0µin (0.76µm) Gold 508 40 (2 x 20) Beryllium Copper 0.100' (2.54mm) Brass 0.500' (12.70mm) - 3 A 40-650 Bulk
110-88-320-41-530000 Mill-Max Manufacturing Corp. CONN IC SKT DBL Išparduota 110-88-320-41-530000.pdf - -55°C ~ 125°C Through Hole Solder DIP, 0.3" (7.62mm) Row Spacing Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) - - - 110 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm 3 A 110-88 Bulk
116-43-320-61-007000 Mill-Max Manufacturing Corp. CONN IC SKT DBL Sandelyje34520 pcs 116-43-320-61-007000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 116 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.402" (10.21mm) 10mOhm 3 A 116-43 Tube
510-91-154-13-021001 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL Sandelyje35402 pcs   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 510 154 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm 3 A 510-91 Bulk
514-87-432M31-001148 Preci-Dip CONN SOCKET BGA 432POS GOLD Sandelyje45618 pcs   - -55°C ~ 125°C Surface Mount Solder BGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 514 432 (31 x 31) Beryllium Copper 0.100" (2.54mm) Brass 0.055" (1.40mm) 10mOhm 1 A 514-87 Bulk
614-41-304-41-001000 Mill-Max Manufacturing Corp. SKT CARRIER PGA Sandelyje28374 pcs 614-41-304-41-001000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 614 4 (2 x 2) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.165" (4.19mm) 10mOhm 3 A 614-41 Tube
614-91-310-41-001000 Mill-Max Manufacturing Corp. SKT CARRIER PGA Sandelyje41688 pcs   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 614 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.165" (4.19mm) 10mOhm 3 A 614-91 Tube
40-6574-18 Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN Sandelyje28915 pcs 40-6574-18.pdf 200.0µin (5.08µm) - Through Hole Solder DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame UL94 V-0 Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 57 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) - 1 A 40-6574 Bulk
510-91-155-18-121001 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL Sandelyje47124 pcs   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 510 155 (18 x 18) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm 3 A 510-91 Bulk
523-93-065-10-051001 Mill-Max Manufacturing Corp. SKT PGA WRAPOST Išparduota   200.0µin (5.08µm) - Through Hole Wire Wrap PGA - - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 523 65 (10 x 10) - 0.100" (2.54mm) - 0.510" (12.95mm) - - 523-93 Bulk
614-87-328-31-012101 Preci-Dip CONN IC DIP SOCKET 28POS GOLD Sandelyje46009 pcs   - -55°C ~ 125°C Through Hole Solder DIP, 0.3' (7.62mm) Row Spacing Carrier, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100' (2.54mm) Gold Flash Tin 614 28 (2 x 14) Beryllium Copper 0.100' (2.54mm) Brass 0.136' (3.45mm) 10mOhm 1 A 614-87 Bulk
232-2601-50-0602 3M IN-LINE ZIP STRIP POCKETS 32 CON Sandelyje31588 pcs   - - - - - - - - - - - - - - - - - - 25mOhm - 232 -
515-13-114-13-061001 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL Išparduota 515-13-114-13-061001.pdf 10.0µin (0.25µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 515 114 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm 3 A 515-13 Bulk
511-13-144-15-082001 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL Išparduota 511-13-144-15-082001.pdf 10.0µin (0.25µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 511 144 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm 3 A 511-13 Bulk
126-41-328-41-002000 Mill-Max Manufacturing Corp. CONN IC SKT DBL Sandelyje47791 pcs 126-41-328-41-002000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Through Hole Wire Wrap DIP, 0.3" (7.62mm) Row Spacing Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 126 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.543" (13.79mm) 10mOhm 3 A 126-41 Tube
48-81000-610C Aries Electronics CONN IC DIP SOCKET 48POS GOLD Sandelyje31074 pcs 48-81000-610C.pdf 10.0µin (0.25µm) -55°C ~ 105°C Through Hole Solder DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 8 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) - 3 A 48-8100 Bulk
510-87-109-12-051101 Preci-Dip CONN SOCKET PGA 109POS GOLD Sandelyje42341 pcs   - -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100' (2.54mm) Gold Flash Tin 510 109 (12 x 12) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) 10mOhm 1 A 510-87 Bulk
24-6575-11 Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN Sandelyje38425 pcs 24-6575-11.pdf 200.0µin (5.08µm) - Through Hole Solder DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame UL94 V-0 Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 57 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) - 1 A 24-6575 Bulk
523-13-177-15-061002 Mill-Max Manufacturing Corp. SKT PGA WRAPOST Išparduota 523-13-177-15-061002.pdf 10.0µin (0.25µm) - Through Hole Wire Wrap PGA - - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 523 177 (15 x 15) - 0.100" (2.54mm) - 0.510" (12.95mm) - - 523-13 Bulk
511-93-128-13-041003 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL Išparduota   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 511 128 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm 3 A 511-93 Bulk
7010321946 3M TEXTOOLTEST & BURN-IN BALL GRID Sandelyje35930 pcs   - - - - - - - - - - - - * - - - - - - - - Bulk
511-93-069-11-061003 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL Išparduota   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 511 69 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm 3 A 511-93 Bulk
122-11-624-41-001000 Mill-Max Manufacturing Corp. CONN IC SKT DBL Sandelyje42348 pcs 122-11-624-41-001000.pdf - -55°C ~ 125°C Through Hole Wire Wrap DIP, 0.6" (15.24mm) Row Spacing Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) - - - 122 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm 3 A 122-11 Tube
511-13-056-09-041001 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL Išparduota 511-13-056-09-041001.pdf 10.0µin (0.25µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 511 56 (9 x 9) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm 3 A 511-13 Bulk
511-91-124-14-071003 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL Išparduota   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 511 124 (14 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm 3 A 511-91 Bulk
122-11-210-41-001000 Mill-Max Manufacturing Corp. CONN IC SKT DBL Sandelyje47685 pcs 122-11-210-41-001000.pdf - -55°C ~ 125°C Through Hole Wire Wrap DIP, 0.2" (5.08mm) Row Spacing Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) - - - 122 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm 3 A 122-11 Tube
16-7XXXX-10 Aries Electronics CONN SOCKET SIP 16POS TIN Išparduota 16-7XXXX-10.pdf 200.0µin (5.08µm) -55°C ~ 105°C Through Hole Solder SIP Elevated UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100' (2.54mm) Tin 200.0µin (5.08µm) Tin 700 Elevator Strip-Line™ 16 (1 x 16) Phosphor Bronze 0.100' (2.54mm) Phosphor Bronze 0.150' (3.81mm) - 1.5 A 16-7XXX Bulk
614-41-306-31-002000 Mill-Max Manufacturing Corp. SKT CARRIER PGA Sandelyje34157 pcs 614-41-306-31-002000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 614 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) 10mOhm 3 A 614-41 Tube
515-91-084-10-031001 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL Išparduota   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 515 84 (10 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm 3 A 515-91 Bulk
540-99-020-17-400200 Mill-Max Manufacturing Corp. CONN SOCKET PLCC 20POS TIN-LEAD Išparduota 540-99-020-17-400200.pdf 200.0µin (5.08µm) - Surface Mount Solder PLCC Closed Frame UL94 V-0 Polyphenylene Sulfide (PPS) 0.050' (1.27mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 540 20 (4 x 5) - 0.050' (1.27mm) - - 20mOhm - 540-99 Tube
110-93-310-61-105000 Mill-Max Manufacturing Corp. CONN IC SKT DBL Sandelyje49234 pcs   200.0µin (5.08µm) -55°C ~ 125°C Surface Mount Solder DIP, 0.3" (7.62mm) Row Spacing Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 110 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm 3 A 110-93 Tube
126-41-964-41-001000 Mill-Max Manufacturing Corp. CONN IC SKT DBL Sandelyje33315 pcs 126-41-964-41-001000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Through Hole Wire Wrap DIP, 0.9" (22.86mm) Row Spacing Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 126 64 (2 x 32) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.425" (10.80mm) 10mOhm 3 A 126-41 Tube
110-43-422-61-105000 Mill-Max Manufacturing Corp. CONN IC SKT DBL Sandelyje49467 pcs 110-43-422-61-105000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Surface Mount Solder DIP, 0.4" (10.16mm) Row Spacing Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 110 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm 3 A 110-43 Tube
28-6513-10H Aries Electronics CONN IC DIP SOCKET 28POS GOLD Sandelyje35399 pcs 28-6513-10H.pdf 200.0µin (5.08µm) -55°C ~ 105°C Through Hole Solder DIP, 0.6' (15.24mm) Row Spacing Closed Frame UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100' (2.54mm) Gold 10.0µin (0.25µm) Tin Lo-PRO®file, 513 28 (2 x 14) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) - 3 A 28-6513 Bulk
19-0513-11 Aries Electronics CONN SOCKET SIP 19POS GOLD Sandelyje41494 pcs 19-0513-11.pdf 10.0µin (0.25µm) - Through Hole Solder SIP - UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100' (2.54mm) Gold 10.0µin (0.25µm) Gold 0513 19 (1 x 19) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) - 3 A 19-0513 Bulk
0784990001 Molex 0784990001 Išparduota   - - - - - - - - - - - - * - - - - - - - 078499 Bulk
523-93-025-05-000003 Mill-Max Manufacturing Corp. SKT PGA WRAPOST Išparduota   200.0µin (5.08µm) - Through Hole Wire Wrap PGA - - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 523 25 (5 x 5) - 0.100" (2.54mm) - 0.510" (12.95mm) - - 523-93 Bulk
1-6437531-1 TE Connectivity AMP Connectors 512-22426-LF=LED SOCKET ASSY Išparduota   - - - - - - - - - - - - - - - - - - - - 6437531 Bulk
510-91-209-17-081002 Mill-Max Manufacturing Corp. SOCKET SOLDERTAIL 209-PGA Sandelyje34316 pcs   - -55°C ~ 125°C Through Hole Solder PGA Open Frame - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) - - 209 (17 x 17) Beryllium Copper 0.100" (2.54mm) Brass Alloy - - - - -
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