Produktų sąrašas
| Palyginkite | Vaizdas | Dalis # | Gamintojas | apibūdinimas | Inventorius | Duomenų lapai | RoHS | Gamintojo standartinis pratęsimo laikas | Išsamus aprašymas | "Lead Free Status / RoHS" statusas | Drėgmės jautrumo lygis (MSL) | Kiti vardai | RAM dydis | Darbinė temperatūra | Dydis / Matmenys | Jungties tipas | Pagrindinis procesorius | Modulis / valdybos tipas | Greitis | Bendro procesorius | Flash dydis | Serija | Bazinis produkto numeris | Paketas | Kiekis |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0714-03-35-2I | Trenz Electronic GmbH | IC MODULE | Sandelyje39429 pcs | TE0714-03-35-2I.pdf | - | - | - | - | - | - | -40°C ~ 85°C | - | - | Artix-7 A35T | FPGA Core | - | - | - | TE0714 | TE0714 | Bulk | |||
 |
DC-V-H264-10B-30-1080-MXC-ZL | System-On-Chip (SOC) Technologies Inc. | IC MOD ARTIX-7 A200T 256KB 32MB | Sandelyje14688 pcs | DC-V-H264-10B-30-1080-MXC-ZL.pdf | - | - | - | - | - | 256KB | 0°C ~ 85°C | 2.700" L x 2.000" W (68.00mm x 51.00mm) | SO-DIMM-204 | Artix-7 A200T | FPGA Core | - | - | 32MB | H.264-HD Decoder | - | Bulk | |||
 |
TE0820-02-03EG-1EA | Trenz Electronic GmbH | IC MODULE ZYNQ USCALE 1GB 128MB | Sandelyje6153 pcs | TE0820-02-03EG-1EA.pdf | - | - | - | - | - | 1GB | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | B2B | Zynq UltraScale+ XCZU3EG-1SFVC784E | MPU Core | - | - | 128MB | TE0820 | - | Bulk | |||
 |
MYC-C3358-V4-512N512D-100-C | MYIR Tech Limited | MYC-AM3358 CPU Module | Sandelyje35674 pcs | MYC-C3358-V4-512N512D-100-C.pdf | - | - | - | - | - | 512MB | 0°C ~ 70°C | 2.756" L x 1.969" W (70.00mm x 50.00mm) | Pin(s) | ARM® Cortex®-A8 | MPU Core | 1GHz | - | - | MYC-AM335X | - | Book | |||
 |
TE0841-02-040-1C | Trenz Electronic GmbH | IC MODULE USCALE 2GB 64MB | Sandelyje6822 pcs | TE0841-02-040-1C.pdf | - | - | - | - | - | 2GB | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | B2B | Kintex UltraScale KU40 | MCU, FPGA | - | - | 64MB | TE0841 | - | Bulk | |||
 |
SOMDM3730-11-1783IFXR | Beacon EmbeddedWorks | IC MOD DM3730 800MHZ 256MB | Sandelyje16140 pcs | SOMDM3730-11-1783IFXR.pdf | - | - | - | - | - | 256MB | -20°C ~ 70°C | 3.000" L x 1.220" W (76.20mm x 31.00mm) | - | DM3730 | MPU Core | 800MHz | - | 512MB (NAND), 16MB (NOR) | DM37x | - | Bulk | |||
|
MYC-C3352-V4-512N512D-80-I | MYIR Tech Limited | MYC-AM3352 CPU Module | Sandelyje44527 pcs | MYC-C3352-V4-512N512D-80-I.pdf | - | - | - | - | - | 512MB | -40°C ~ 85°C | 2.756" L x 1.969" W (70.00mm x 50.00mm) | Pin(s) | ARM® Cortex®-A8 | MPU Core | 1GHz | - | - | MYC-AM335X | - | Book | |||
 |
20-101-0081 | Digi International | CORE MODULE CM7100 | Sandelyje35774 pcs | 20-101-0081.pdf | 12 Weeks | CM7000 Embedded Module Z180 18.432MHz 128KB 512KB EPROM | Lead free / RoHS Compliant | 1 (Unlimited) | 20-101-0081-ND 316-1192 |
128KB | -40°C ~ 70°C | 1.8" x 2.05" (46mm x 52mm) | 40 Pin Header | Z180 | MPU Core | 18.432MHz | - | 512KB EPROM | CM7000 | - | - | |||
 |
XPDNC200S-01 | Lantronix, Inc. | IC MOD DSTNI-EX 25MHZ 256KB | Sandelyje47509 pcs | XPDNC200S-01.pdf | - | - | - | - | - | 256KB | -40°C ~ 85°C | 1.250" L x 1.700" W (31.80mm x 43.30mm) | RJ45 | DSTni-EX | MPU Core | 25MHz | XPort Direct+ | 512KB | XPort® Direct+™ | XPDNC200 | Box | |||
 |
TE0715-04-15-2I | Trenz Electronic GmbH | IC MOD CORTEX-A9 125MHZ 1GB 32MB | Sandelyje10690 pcs | TE0715-04-15-2I.pdf | - | - | - | - | - | 1GB | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | Samtec LSHM | ARM Cortex-A9 | MCU, FPGA | 125MHz | Zynq-7000 (Z-7015) | 32MB | TE0715 | TE0715 | Bulk | |||
 |
TE0720-03-31C33MA | Trenz Electronic GmbH | IC SOC MODULE XILINX ZYNQ | Sandelyje12037 pcs | TE0720-03-31C33MA.pdf | - | - | - | - | - | 1GB | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | Samtec LSHM | ARM Cortex-A9 | MCU, FPGA | 766MHz | Zynq-7000 (Z-7014S) | 8GB | TE0720 | - | Bulk | |||
 |
DC-ME-Y402-S | Digi | IC MOD ARM926EJ-S 75MHZ 8MB | Sandelyje14977 pcs | DC-ME-Y402-S.pdf | - | - | - | - | - | 8MB | -40°C ~ 80°C | 1.450' L x 0.750' W (36.70mm x 19.10mm) | RJ45 | ARM926EJ-S, NS9210 | MPU Core | 75MHz | - | 4MB | Digi Connect ME® | - | Bulk | |||
|
EC-VA-H264-10B-60-1080-MXC-LL | System-On-Chip (SOC) Technologies Inc. | IC MOD ARTIX-7 A200T 256KB 32MB | Sandelyje8304 pcs | EC-VA-H264-10B-60-1080-MXC-LL.pdf | - | - | - | - | - | 256KB | 0°C ~ 85°C | 2.700" L x 2.000" W (68.00mm x 51.00mm) | SO-DIMM-204 | Artix-7 A200T | FPGA Core | - | - | 32MB | H.264-HD Encoder | - | Bulk | |||
 |
TE0600-03-52I11-W | Trenz Electronic GmbH | IC MODULE GIGABEE | Sandelyje11809 pcs | TE0600-03-52I11-W.pdf | - | - | - | - | - | 256MB | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | Samtec LSHM | Spartan-6 LX-45 | FPGA Core | 125MHz | - | 16MB | - | - | Bulk | |||
 |
TE0741-03-070-2CF | Trenz Electronic GmbH | IC MOD KINTEX-7 70T 200MHZ 32MB | Sandelyje4102 pcs | TE0741-03-070-2CF.pdf | - | - | - | - | - | - | 0°C ~ 70°C | 1.970' L x 1.570' W (50.00mm x 40.00mm) | Samtec LSHM | Kintex-7 70T | FPGA Core | 200MHz | - | 32MB | TE0741 | TE0741 | Bulk | |||
 |
CENGPXA270-312-10-550ECR | Beacon EmbeddedWorks | IC MOD PXA270 312MHZ 64MB | Sandelyje13544 pcs | CENGPXA270-312-10-550ECR.pdf | - | - | - | - | - | 64MB | 0°C ~ 70°C | 2.370' L x 2.670' W (60.20mm x 67.80mm) | SO-DIMM-144 | PXA270 | MCU Core | 312MHz | - | 64MB | - | - | Box | |||
 |
TE0600-03IVF | Trenz Electronic GmbH | IC MOD LX150 125MHZ 256MB | Sandelyje14786 pcs | TE0600-03IVF.pdf | - | - | - | - | - | 256MB | -40°C ~ 85°C | 1.970' L x 1.570' W (50.00mm x 40.00mm) | Samtec LSHM | Spartan-6 LX-150 | FPGA Core | 125MHz | - | 16MB | TE0600 | TE0600 | Bulk | |||
 |
MYC-C8MMQ6-V2-8E2D-160-I | MYIR Tech Limited | MYC-C8MMX-V2 CPU MODULE,NXP SOM | Sandelyje32081 pcs | - | - | - | - | - | 32KB | -40°C ~ 85°C | 2.360" L x 1.930" W (60.00mm x 49.00mm) | Board-to-Board (BTB) Socket | ARM® Cortex®-A53, ARM® Cortex®-M4 | MPU Core | 400MHz, 1.8GHz | ARM® Cortex®-M4F | - | - | - | Book | ||||
 |
MYC-JX8MPQ-8E3D-160-C | MYIR Tech Limited | MYC-JX8MPQ CPU MODULE,NXP SOM | Sandelyje41531 pcs | - | - | - | - | - | 3GB | 0°C ~ 70°C | 3.230" L x 1.770" W (82.00mm x 45.00mm) | Card Edge | ARM® Cortex®-A53, ARM® Cortex®-M7 | MPU Core | 800MHz, 1.6GHz | - | 8GB | - | - | Book | ||||
 |
TE0745-02-81C11-A | Trenz Electronic GmbH | SOM MIT XILINX ZYNQ | Sandelyje15315 pcs | TE0745-02-81C11-A.pdf | - | - | - | - | - | 1GB | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | Samtec ST5 | ARM® Cortex®-A9 | MCU, FPGA | - | Zynq-7000 (Z-7035) | 32MB | TE0745 | TE0745 | Bulk | |||
 |
DC-ME4-01T-C | Digi | IC MODULE ARM7TDMI 55MHZ 8MB | Sandelyje30974 pcs | DC-ME4-01T-C.pdf | - | - | - | - | - | 8MB | -40°C ~ 85°C | 1.450" L x 0.750" W (36.70mm x 19.10mm) | RJ45 | ARM7TDMI, NS7520 | MPU Core | 55MHz | - | 4MB | Digi Connect ME® | DC-ME4 | Box | |||
 |
TE0808-04-6BE21-A | Trenz Electronic GmbH | IC MODULE ZYNQ USCALE 4GB 128MB | Sandelyje12867 pcs | TE0808-04-6BE21-A.pdf | - | - | - | - | - | 4GB | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | B2B | Zynq UltraScale+ XCZU6EG-1FFVC900E | MPU Core | - | - | 128MB | TE0808 | TE0808 | Bulk | |||
|
TE0600-03IC4 | Trenz Electronic GmbH | IC MODULE GIGABEE | Sandelyje17560 pcs | TE0600-03IC4.pdf | - | - | - | - | - | 256MB | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | Samtec LSHM | Spartan-6 LX-45 | FPGA Core | 125MHz | - | 16MB | - | - | Bulk | |||
 |
TE0841-01-035-2I | Trenz Electronic GmbH | IC MODULE USCALE 4GB 32MB | Sandelyje3761 pcs | TE0841-01-035-2I.pdf | - | - | - | - | - | 4GB | -40°C ~ 85°C | 1.970' L x 1.570' W (50.00mm x 40.00mm) | Samtec LSHM | Kintex UltraScale KU35 | FPGA Core | - | - | 32MB | TE0841 | - | Bulk | |||
 |
TE0741-02-325-2IF | Trenz Electronic GmbH | IC MOD KINTEX-7 325T 200MHZ 32MB | Sandelyje9285 pcs | TE0741-02-325-2IF.pdf | - | - | - | - | - | - | -40°C ~ 85°C | 1.970' L x 1.570' W (50.00mm x 40.00mm) | Samtec LSHM | Kintex-7 325T | FPGA Core | 200MHz | - | 32MB | TE0741 | - | Bulk | |||
 |
EC-VA-H264-10B-60-1080-OPVXC-0000 | System-On-Chip (SOC) Technologies Inc. | ENCODER H264 HD VID/AUD 10BIT | Sandelyje31537 pcs | EC-VA-H264-10B-60-1080-OPVXC-0000.pdf | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | EC-VA-H264 | Box | |||
 |
TE0741-04-B2I-1-A | Trenz Electronic GmbH | MODULE FPGA KINTEX | Sandelyje40778 pcs | TE0741-04-B2I-1-A.pdf | - | - | - | - | - | - | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | Board-to-Board (BTB) Socket | Xilinx Kintex-7 FPGA XC7K160T-2FBG676I | FPGA Core | - | - | 32MB | - | - | Box | |||
 |
20-101-1142 | Digi | 20-101-1142 | Sandelyje6100 pcs | - | - | - | - | - | 512KB | -20°C ~ 85°C | 1.850" L x 2.840" W (47.00mm x 72.00mm) | Header | Rabbit 4000 | MPU Core | 58.98MHz | - | 4MB | - | - | Bulk | ||||
|
DC-ME-Y402-MF | Digi | IC MOD ARM926EJ-S 75MHZ 8MB | Sandelyje13382 pcs | DC-ME-Y402-MF.pdf | - | - | - | - | - | 8MB | -40°C ~ 80°C | 1.450' L x 0.750' W (36.70mm x 19.10mm) | RJ45 | ARM926EJ-S, NS9210 | MPU Core | 75MHz | - | 4MB | Digi Connect ME® | - | Bulk | |||
|
DC-ME-01T-TR | Digi | MODULE ME | Sandelyje13731 pcs | DC-ME-01T-TR.pdf | - | - | - | - | - | - | - | - | - | - | - | - | - | - | * | - | Bulk | |||
|
TE0723-03-41C64-A | Trenz Electronic GmbH | IC MOD CORTEX-A9 12MHZ 512MB | Sandelyje49209 pcs | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Bulk | ||||
|
TE0630-02IV | Trenz Electronic GmbH | IC MODULE LX150 100MHZ 128MB | Sandelyje31749 pcs | TE0630-02IV.pdf | - | - | - | - | - | 128MB | -40°C ~ 85°C | 1.600" L x 1.900" W (40.50mm x 47.50mm) | B2B | Spartan-6 LX-150 | FPGA, USB Core | 100MHz | Cypress EZ-USB FX2LP | 8MB | TE0630 | TE0630 | Bulk | |||
|
CC-MX-MB58-ZM-B | Digi | MODULE I.MX51 256MB FLASH 25PK | Sandelyje4503 pcs | CC-MX-MB58-ZM-B.pdf | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ConnectCore® | - | Bulk | |||
 |
CENGLH7A400-10-402HC | Beacon EmbeddedWorks | IC MOD ARM922T 200MHZ 64MB | Sandelyje11823 pcs | CENGLH7A400-10-402HC.pdf | - | - | - | - | - | 64MB | 0°C ~ 70°C | 2.370" L x 2.670" W (60.20mm x 67.80mm) | SO-DIMM-144 | ARM922T, LH7A400 | MPU Core | 200MHz | - | 16MB | - | - | - | |||
|
TE0712-03-72C36-A | Trenz Electronic GmbH | FPGA MODULE ARTIX7 | Sandelyje48001 pcs | - | - | - | - | - | 1GB | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | Board-to-Board (BTB) Socket - 160 | Artix-7 XC7A100T-2FGG484C | FPGA | - | - | 32MB | TE0712 | - | Bulk | ||||
|
FS-3000 | Digi | MODULE 128MB SDRAM 128MB FLASH | Sandelyje14214 pcs | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Box | ||||
|
CC-9C-V223-ZA | Digi | MODULE 9C | Sandelyje11546 pcs | CC-9C-V223-ZA.pdf | - | - | - | - | - | - | - | - | - | - | - | - | - | - | * | - | Bulk | |||
|
CENGLH79520-10-403HCR | Beacon EmbeddedWorks | IC MOD ARM720T 77.4MHZ 32MB | Sandelyje14698 pcs | - | - | - | - | - | 32MB | 0°C ~ 70°C | 2.370' L x 2.670' W (60.20mm x 67.80mm) | SO-DIMM-144 | ARM720T, LH79520 | MPU Core | 77.4MHz | - | 16MB | - | - | Bulk | ||||
|
101-0508 | Digi | IC MOD RABBIT 3000 30MHZ 128KB | Sandelyje4591 pcs | 101-0508.pdf | - | - | - | - | - | 128KB | -40°C ~ 70°C | 1.850" L x 2.730" W (47.00mm x 69.00mm) | 2 IDC Headers 2x17 | Rabbit 3000 | MPU Core | 30MHz | - | 256KB | RabbitCore® | - | - | |||
|
DC-SP-01R-JT | Digi | IC MOD ARM7TDMI 55MHZ 16MB | Sandelyje4696 pcs | - | - | - | - | - | 16MB | 0°C ~ 60°C | 1.680' L x 3.880' W (42.70mm x 98.50mm) | RJ45 | ARM7TDMI, NS7520 | MPU Core | 55MHz | - | 4MB | Digi Connect SP | - | Bulk | ||||
|
TE0820-05-4AI21MI | Trenz Electronic GmbH | MOD MPSOC 2GB DDR4 | Sandelyje7454 pcs | - | - | - | - | - | 2GB | - | - | - | - | MPU Core | - | - | 128MB | TE0820 | - | Bulk | ||||
|
TE0803-03-4DE11-A | Trenz Electronic GmbH | IC MODULE ZYNQ USCALE 2GB 128MB | Sandelyje13209 pcs | TE0803-03-4DE11-A.pdf | - | - | - | - | - | 2GB | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | B2B | Zynq UltraScale+ XCZU4EV-1SFVC784E | MPU Core | - | - | 128MB | TE0803 | TE0803 | Bulk | |||
|
CC-9C-V226-ZA | Digi | IC MOD ARM926EJ-S 155MHZ 32MB | Sandelyje17511 pcs | CC-9C-V226-ZA.pdf | - | - | - | - | - | 32MB | -40°C ~ 85°C | 3.590' L x 2.060' W (91.20mm x 52.20mm) | SO-DIMM-144 | ARM926EJ-S, NS9360 | MPU Core | 155MHz | - | 64MB | ConnectCore® | - | Bulk | |||
|
TE0823-01-S002 | Trenz Electronic GmbH | ICOBOARD | Sandelyje11365 pcs | TE0823-01-S002.pdf | - | - | - | - | - | - | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | USB | ARM Cortex-A53, ARM® Cortex®-R5 | MCU, FPGA | - | - | - | TE0823 | - | Bulk | |||
|
TE0803-02-03-1EA-S | Trenz Electronic GmbH | IC MODULE ZYNQ USCALE 2GB 128MB | Sandelyje15444 pcs | TE0803-02-03-1EA-S.pdf | - | - | - | - | - | 2GB | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | B2B | Zynq UltraScale+ XCZU3EG-1SFVC784E | FPGA Core | - | - | 128MB | TE0803 | - | Bulk | |||
|
CC-MX-LB47-ZM-B | Digi | MODULE I.MX51 128MB FLASH 25PK | Sandelyje13490 pcs | CC-MX-LB47-ZM-B.pdf | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ConnectCore® | - | Bulk | |||
|
TE0745-02-30-2I | Trenz Electronic GmbH | IC MODULE CORTEX-A9 1GB 64MB | Sandelyje15368 pcs | TE0745-02-30-2I.pdf | - | - | - | - | - | 1GB | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | B2B | ARM® Cortex®-A9 | MCU, FPGA | - | Zynq-7000 (Z-7030) | 64MB | TE0745 | - | Bulk | |||
 |
MYC-C3358-512N512D-100-I | MYIR Tech Limited | ARM TI AM3358 SOM,512MB DDR,512M | Sandelyje35503 pcs | - | - | - | - | - | 512MB | -40°C ~ 85°C | 2.76" x 1.97" (70mm x 50mm) | - | ARM® Cortex®-A8 | MPU Core | 1GHz | - | 512MB | - | - | - | ||||
|
TE0803-02-03CG-1EA | Trenz Electronic GmbH | MODULE SOM TE0803-02 | Sandelyje9208 pcs | TE0803-02-03CG-1EA.pdf | - | - | - | - | - | - | - | 2.050" L x 2.990" W (52.00mm x 76.00mm) | B2B | - | MPU Core | - | - | - | TE0803 | - | Bulk | |||
 |
ME-XU7-9EG-2I-D12E-R4.1 | Enclustra FPGA Solutions | SOM ZYNQ XU7 US+ ZU9EG | Sandelyje4400 pcs | ME-XU7-9EG-2I-D12E-R4.1.pdf | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |